The Technology Strategy Board is to invest up to £4.75m to stimulate innovation and growth in the manufacture of electronic systems. We are looking to fund projects that explore novel manufacturing processes that could lead to new ways of making products in future. The early exploitation of these processes should improve competitiveness by enhancing functionality, reducing size or cost, adapting form and/or enabling rapid scale-up. We will fund projects that involve one or more of the following areas:
- ways to manufacture electronics, sensors and photonics for hostile environments (for example sub-sea, high temperature or potentially explosive atmospheres)
- integration of printed electronics with conventional electronics (for example to enhance functionality, reduce size/cost or adapt form)
- methods of manufacturing complex flexible substrates for high-density electronics
- in-built intelligence to enhance the manufacturing process (for example self-testing or self-awareness to enhance end-of-life value)
- methods of embedding sensors, high-tolerance components or electronics into structures and/or materials (for example substrates)
- test instruments and techniques to eliminate R&D-intensive activities from the manufacturing process
- manufacturing techniques for high-density assembly or 3-D integration (for example chip-on-chip)
- methods to integrate bespoke devices (for example mechanical or through-hole components) with conventional surface-mount assembly.
Further information on the application process and briefing events can be found here:
As part of the competition, we have secured additional funding for design consultants who may help applicants explore design concepts. The design consultants are available on a first-come, first-served basis, so please act now to secure this additional support.
Regional dates for events are:
20th January: Glasgow
24th January: Bristol
28th January: Durham
30th January: London
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